
NUP45V6P5
ELECTRICAL CHARACTERISTICS
(T A = 25 ° C unless otherwise noted)
Symbol Parameter
I PP
Maximum Reverse Peak Pulse Current
V C
Clamping Voltage @ I PP
I F
I
I R V F
V RWM
I R
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ V RWM
V C V BR V RWM
I T
V
V BR
I T
Breakdown Voltage @ I T
Test Current
Q V BR
I F
V F
Z ZT
I ZK
Z ZK
Maximum Temperature Coefficient of V BR
Forward Current
Forward Voltage @ I F
Maximum Zener Impedance @ I ZT
Reverse Current
Maximum Zener Impedance @ I ZK
I PP
Uni ? Directional
MAXIMUM RATINGS (T A = 25 ° C unless otherwise noted)
Characteristic
Thermal Resistance Junction ? to ? Ambient
Above 25 ° C, Derate
Maximum Junction Temperature
Operating Junction and Storage Temperature Range
Lead Solder Temperature (10 seconds duration)
Human Body Model (HBM)
Machine Model (MM)
Symbol
R q JA
T Jmax
T J T stg
T L
ESD
Value
560
4.5
150
? 55 to +150
260
8000
400
Unit
° C/W
mW/ ° C
° C
° C
° C
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
ELECTRICAL CHARACTERISTICS (T A = 25 ° C)
Device
Breakdown Voltage
V BR @ 1 mA (Volts)
Leakage Current
I RM @ V RM
Typ Capacitance
@ 0 V Bias (pF)
Typ Capacitance
@ 3 V Bias (pF)
V C (V)
@ I PP = 1 A
Device
NUP45V6P5
Marking
5
Min
5.3
Nom
5.6
Max
5.9
V RWM
3.0
I RWM ( m A)
1.0
Typ
13
Max
17
Typ
7.0
Max
11.5
Max
10.5
1. Capacitance of one diode at f = 1 MHz, T A = 25 ° C.
2. Surge current waveform per Figure
3.http://onsemi.com
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